LP2998-Q1
- AEC-Q100 Test Guidance with the following results
(SO PowerPAD-8):- Device HBM ESD Classification Level H1C
- Junction Temperature Range –40°C to 125°C
- 1.35 V Minimum VDDQ
- Source and Sink Current
- Low Output Voltage Offset
- No External Resistors Required
- Linear Topology
- Suspend to Ram (STR) Functionality
- Low External Component Count
- Thermal Shutdown
The LP2998 linear regulator is designed to meet JEDEC SSTL-2 and JEDEC SSTL-18 specifications for termination of DDR-SDRAM and DDR2 memory. The device also supports DDR3 and DDR3L VTT bus termination with VDDQ min of 1.35 V. The device contains a high-speed operational amplifier to provide excellent response to load transients. The output stage prevents shoot through while delivering 1.5 A continuous current and transient peaks up to 3 A in the application as required for DDR-SDRAM termination. The LP2998 also incorporates a VSENSE pin to provide superior load regulation and a VREF output as a reference for the chipset and DIMMs.
An additional feature found on the LP2998 is an active low shutdown (SD) pin that provides Suspend To RAM (STR) functionality. When SD is pulled low the VTT output will tri-state providing a high impedance output, but, VREF will remain active. A power savings advantage can be obtained in this mode through lower quiescent current.
技術文檔
| 類型 | 標題 | 下載最新的英語版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數據表 | LP2998/LP2998-Q1 DDR Termination Regulator 數據表 (Rev. K) | PDF | HTML | 2014年 8月 20日 | ||
| EVM 用戶指南 | AN-1813 LP2998 Evaluation Board (Rev. A) | 2013年 5月 7日 |
設計和開發
如需其他信息或資源,請點擊以下任一標題進入詳情頁面查看(如有)。
LP2998EVAL — 用于 LP2998 的評估板
The LP2998 evaluation board is designed to provide the design Engineer with a fully functional prototype system in which to evaluate the LP2998 in both a static environment and with a complete memory system.
TIDA-00275 — 汽車儀表組寬 Vin 電源設計
| 封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
|---|---|---|
| HSOIC (DDA) | 8 | Ultra Librarian |
訂購和質量
- RoHS
- REACH
- 器件標識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時基故障估算
- 材料成分
- 鑒定摘要
- 持續可靠性監測
- 制造廠地點
- 封裝廠地點
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