DS90LV017A
- >600 Mbps (300 MHz) Switching Rates
- 0.3 ns Typical Differential Skew
- 0.7 ns Maximum Differential Skew
- 1.5 ns Maximum Propagation Delay
- 3.3V Power Supply Design
- ±355 mV Differential Signaling
- Low Power Dissipation (23 mW @ 3.3V Static)
- Flow-Through Design Simplifies PCB Layout
- Interoperable with Existing 5V LVDS Devices
- Power Off Protection (Outputs in High Impedance)
- Conforms to TIA/EIA-644 Standard
- 8-Lead SOIC Package Saves Space
- Industrial Temperature Operating Range
- (?40°C to +85°C)
All trademarks are the property of their respective owners.
The DS90LV017A is a single LVDS driver device optimized for high data rate and low power applications. The DS90LV017A is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized. The device is designed to support data rates in excess of 600Mbps (300MHz) utilizing Low Voltage Differential Signaling (LVDS) technology.
The device is in a 8-lead SOIC package. The DS90LV017A has a flow-through design for easy PCB layout. The differential driver outputs provides low EMI with its typical low output swing of 355 mV. The DS90LV017A can be paired with its companion single line receiver, the DS90LV018A, or with any of TI's LVDS receivers, to provide a high-speed point-to-point LVDS interface.
技術(shù)文檔
| 類型 | 標(biāo)題 | 下載最新的英語(yǔ)版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數(shù)據(jù)表 | DS90LV017A LVDS Single High Speed Differential Driver 數(shù)據(jù)表 (Rev. C) | 2013年 4月 16日 | |||
| 應(yīng)用簡(jiǎn)報(bào) | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||||
| 應(yīng)用簡(jiǎn)報(bào) | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||||
| 應(yīng)用手冊(cè) | An Overview of LVDS Technology | 1998年 10月 5日 |
設(shè)計(jì)和開(kāi)發(fā)
如需其他信息或資源,請(qǐng)點(diǎn)擊以下任一標(biāo)題進(jìn)入詳情頁(yè)面查看(如有)。
DS90LV047-48AEVM — DS90LV047-48AEVM 評(píng)估模塊
PSPICE-FOR-TI — PSpice? for TI 設(shè)計(jì)和仿真工具
借助?PSpice for TI 的設(shè)計(jì)和仿真環(huán)境及其內(nèi)置的模型庫(kù),您可對(duì)復(fù)雜的混合信號(hào)設(shè)計(jì)進(jìn)行仿真。創(chuàng)建完整的終端設(shè)備設(shè)計(jì)和原型解決方案,然后再進(jìn)行布局和制造,可縮短產(chǎn)品上市時(shí)間并降低開(kāi)發(fā)成本。?
在?PSpice for TI 設(shè)計(jì)和仿真工具中,您可以搜索 TI (...)
TINA-TI — 基于 SPICE 的模擬仿真程序
TINA-TI 安裝需要大約 500MB。直接安裝,如果想卸載也很容易。我們相信您肯定會(huì)愛(ài)不釋手。
TINA 是德州儀器 (TI) 專有的 DesignSoft 產(chǎn)品。該免費(fèi)版本具有完整的功能,但不支持完整版 TINA 所提供的某些其他功能。
如需獲取可用 TINA-TI 模型的完整列表,請(qǐng)參閱:SpiceRack - 完整列表
需要 HSpice (...)
| 封裝 | 引腳 | CAD 符號(hào)、封裝和 3D 模型 |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
訂購(gòu)和質(zhì)量
- RoHS
- REACH
- 器件標(biāo)識(shí)
- 引腳鍍層/焊球材料
- MSL 等級(jí)/回流焊峰值溫度
- MTBF/時(shí)基故障估算
- 材料成分
- 鑒定摘要
- 持續(xù)可靠性監(jiān)測(cè)
- 制造廠地點(diǎn)
- 封裝廠地點(diǎn)
推薦產(chǎn)品可能包含與 TI 此產(chǎn)品相關(guān)的參數(shù)、評(píng)估模塊或參考設(shè)計(jì)。