產(chǎn)品詳情

Resolution (Bits) 12 Number of DAC channels 2 Interface type Parallel CMOS Sample/update rate (Msps) 200 Features Low Power Rating HiRel Enhanced Product Interpolation 1x Power consumption (typ) (mW) 330 SFDR (dB) 85 Architecture Current Source Operating temperature range (°C) -55 to 125 Reference type Ext
Resolution (Bits) 12 Number of DAC channels 2 Interface type Parallel CMOS Sample/update rate (Msps) 200 Features Low Power Rating HiRel Enhanced Product Interpolation 1x Power consumption (typ) (mW) 330 SFDR (dB) 85 Architecture Current Source Operating temperature range (°C) -55 to 125 Reference type Ext
TQFP (PFB) 48 81 mm2 9 x 9
  • Controlled Baseline
    • One Assembly
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • 12-Bit Dual Transmit Digital-to-Analog Converter (DAC)
  • 200-MSPS Update Rate
  • Single Supply: 3 V to 3.6 V
  • High Spurious-Free Dynamic Range (SFDR): 85 dBc at 5 MHz
  • High Third-Order Two-Tone Intermodulation (IMD3): 78 dBc at 15.1 and 16.1 MHz
  • WCDMA Adjacent Channel Leakage Ratio (ACLR): 70 dB at 30.72 MHz
  • Independent or Single Resistor Gain Control
  • Dual or Interleaved Data
  • On-Chip 1.2-V Reference
  • Low Power: 330 mW
  • Power-Down Mode: 15 mW
  • Package: 48-Pin Thin Quad Flat Pack (TQFP)
  • APPLICATIONS
    • Cellular Base Transceiver Station Transmit Channel
      • CDMA: W-CDMA, CDMA2000, IS-95
      • TDMA: GSM, IS-136, EDGE/UWC-136
    • Medical/Test Instrumentation
    • Arbitrary Waveform Generators (ARB)
    • Direct Digital Synthesis (DDS)
    • Cable Modem Termination System (CMTS)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • 12-Bit Dual Transmit Digital-to-Analog Converter (DAC)
  • 200-MSPS Update Rate
  • Single Supply: 3 V to 3.6 V
  • High Spurious-Free Dynamic Range (SFDR): 85 dBc at 5 MHz
  • High Third-Order Two-Tone Intermodulation (IMD3): 78 dBc at 15.1 and 16.1 MHz
  • WCDMA Adjacent Channel Leakage Ratio (ACLR): 70 dB at 30.72 MHz
  • Independent or Single Resistor Gain Control
  • Dual or Interleaved Data
  • On-Chip 1.2-V Reference
  • Low Power: 330 mW
  • Power-Down Mode: 15 mW
  • Package: 48-Pin Thin Quad Flat Pack (TQFP)
  • APPLICATIONS
    • Cellular Base Transceiver Station Transmit Channel
      • CDMA: W-CDMA, CDMA2000, IS-95
      • TDMA: GSM, IS-136, EDGE/UWC-136
    • Medical/Test Instrumentation
    • Arbitrary Waveform Generators (ARB)
    • Direct Digital Synthesis (DDS)
    • Cable Modem Termination System (CMTS)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The DAC5662 is a monolithic, dual-channel 12-bit, high-speed digital-to-analog converter (DAC) with on-chip voltage reference.

Operating with update rates of up to 200 MSPS, the DAC5662 offers exceptional dynamic performance, tight gain, and offset matching characteristics that make it suitable in either I/Q baseband or direct IF communication applications.

Each DAC has a high-impedance differential-current output, suitable for single-ended or differential analog-output configurations. External resistors allow scaling the full-scale output current for each DAC separately or together, typically between 2 mA and 20 mA. An accurate on-chip voltage reference is temperature compensated and delivers a stable 1.2-V reference voltage. Optionally, an external reference may be used.

The DAC5662 has two 12-bit parallel input ports with separate clocks and data latches. For flexibility, the DAC5662 also supports multiplexed data for each DAC on one port when operating in the interleaved mode.

The DAC5662 has been specifically designed for a differential transformer coupled output with a 50- doubly terminated load. For a 20-mA full-scale output current a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (-2-dBm output power) are supported.

The DAC5662 is available in a 48-pin thin quad flat pack (TQFP). Pin compatibility between family members provides 12-bit (DAC5662) and 14-bit (DAC5672) resolution. Furthermore, the DAC5662 is pin compatible to the DAC2902 and AD9765 dual DACs. The device is characterized for operation over the military temperature range of -55°C to 125°C.

The DAC5662 is a monolithic, dual-channel 12-bit, high-speed digital-to-analog converter (DAC) with on-chip voltage reference.

Operating with update rates of up to 200 MSPS, the DAC5662 offers exceptional dynamic performance, tight gain, and offset matching characteristics that make it suitable in either I/Q baseband or direct IF communication applications.

Each DAC has a high-impedance differential-current output, suitable for single-ended or differential analog-output configurations. External resistors allow scaling the full-scale output current for each DAC separately or together, typically between 2 mA and 20 mA. An accurate on-chip voltage reference is temperature compensated and delivers a stable 1.2-V reference voltage. Optionally, an external reference may be used.

The DAC5662 has two 12-bit parallel input ports with separate clocks and data latches. For flexibility, the DAC5662 also supports multiplexed data for each DAC on one port when operating in the interleaved mode.

The DAC5662 has been specifically designed for a differential transformer coupled output with a 50- doubly terminated load. For a 20-mA full-scale output current a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (-2-dBm output power) are supported.

The DAC5662 is available in a 48-pin thin quad flat pack (TQFP). Pin compatibility between family members provides 12-bit (DAC5662) and 14-bit (DAC5672) resolution. Furthermore, the DAC5662 is pin compatible to the DAC2902 and AD9765 dual DACs. The device is characterized for operation over the military temperature range of -55°C to 125°C.

下載 觀看帶字幕的視頻 視頻

技術(shù)文檔

star =有關(guān)此產(chǎn)品的 TI 精選熱門(mén)文檔
未找到結(jié)果。請(qǐng)清除搜索并重試。
查看全部 6
頂層文檔 類(lèi)型 標(biāo)題 格式選項(xiàng) 下載最新的英語(yǔ)版本 日期
* 數(shù)據(jù)表 DAC5662-EP 數(shù)據(jù)表 (Rev. A) 2006年 10月 10日
* 輻射與可靠性報(bào)告 DAC5662MPFBREP Reliability Report 2016年 8月 16日
* VID DAC5662-EP VID V6206651 2016年 6月 21日
應(yīng)用手冊(cè) High Speed, Digital-to-Analog Converters Basics (Rev. A) 2012年 10月 23日
應(yīng)用手冊(cè) 所選封裝材料的熱學(xué)和電學(xué)性質(zhì) 2008年 10月 16日
應(yīng)用手冊(cè) 高速數(shù)據(jù)轉(zhuǎn)換 英語(yǔ)版 2008年 10月 16日

設(shè)計(jì)與開(kāi)發(fā)

如需其他信息或資源,請(qǐng)點(diǎn)擊以下任一標(biāo)題進(jìn)入詳情頁(yè)面查看(如有)。

模擬工具

PSPICE-FOR-TI — PSpice? for TI 設(shè)計(jì)和仿真工具

PSpice? for TI 可提供幫助評(píng)估模擬電路功能的設(shè)計(jì)和仿真環(huán)境。此功能齊全的設(shè)計(jì)和仿真套件使用 Cadence? 的模擬分析引擎。PSpice for TI 可免費(fèi)使用,包括業(yè)內(nèi)超大的模型庫(kù)之一,涵蓋我們的模擬和電源產(chǎn)品系列以及精選的模擬行為模型。

借助?PSpice for TI 的設(shè)計(jì)和仿真環(huán)境及其內(nèi)置的模型庫(kù),您可對(duì)復(fù)雜的混合信號(hào)設(shè)計(jì)進(jìn)行仿真。創(chuàng)建完整的終端設(shè)備設(shè)計(jì)和原型解決方案,然后再進(jìn)行布局和制造,可縮短產(chǎn)品上市時(shí)間并降低開(kāi)發(fā)成本。?

在?PSpice for TI 設(shè)計(jì)和仿真工具中,您可以搜索 TI (...)
封裝 引腳 CAD 符號(hào)、封裝和 3D 模型
TQFP (PFB) 48 Ultra Librarian

訂購(gòu)和質(zhì)量

包含信息:
  • RoHS
  • REACH
  • 器件標(biāo)識(shí)
  • 引腳鍍層/焊球材料
  • MSL 等級(jí)/回流焊峰值溫度
  • MTBF/時(shí)基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續(xù)可靠性監(jiān)測(cè)
包含信息:
  • 制造廠地點(diǎn)
  • 封裝廠地點(diǎn)

推薦產(chǎn)品可能包含與 TI 此產(chǎn)品相關(guān)的參數(shù)、評(píng)估模塊或參考設(shè)計(jì)。

支持和培訓(xùn)

可獲得 TI 工程師技術(shù)支持的 TI E2E? 論壇

所有內(nèi)容均由 TI 和社區(qū)貢獻(xiàn)者按“原樣”提供,并不構(gòu)成 TI 規(guī)范。請(qǐng)參閱使用條款。

如果您對(duì)質(zhì)量、包裝或訂購(gòu) TI 產(chǎn)品有疑問(wèn),請(qǐng)參閱 TI 支持。??????????????

視頻