產品詳情

Number of channels 4 Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 14 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Supply current (max) (μA) 600 Features Balanced outputs, Positive input clamp diode, Standard speed (tpd > 50ns) Operating temperature range (°C) -55 to 125 Rating Catalog
Number of channels 4 Technology family CD4000 Supply voltage (min) (V) 3 Supply voltage (max) (V) 18 Input type Standard CMOS Output type Push-Pull Clock frequency (max) (MHz) 14 IOL (max) (mA) 6.8 IOH (max) (mA) -6.8 Supply current (max) (μA) 600 Features Balanced outputs, Positive input clamp diode, Standard speed (tpd > 50ns) Operating temperature range (°C) -55 to 125 Rating Catalog
PDIP (N) 16 181.42 mm2 19.3 x 9.4 SOIC (D) 16 59.4 mm2 9.9 x 6 SOP (NS) 16 79.56 mm2 10.2 x 7.8 TSSOP (PW) 16 32 mm2 5 x 6.4
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 μA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range) =
            1 V at VDD = 5 V
            2 V at VDD = 10 V
         2.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Output compatible with two HTL loads, two low power TTL loads, or one low power Schottky TTL load
  • Functional equivalent to TTL74175
  • Standardized, symmetrical output characteristics
  • Applications:
    • Shift registers
    • Buffer/storage registers
    • Pattern generators
  • 100% tested for quiescent current at 20 V
  • Maximum input current of 1 μA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • Noise margin (full package-temperature range) =
            1 V at VDD = 5 V
            2 V at VDD = 10 V
         2.5 V at VDD = 15 V
  • 5-V, 10-V, and 15-V parametric ratings
  • Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"
  • Output compatible with two HTL loads, two low power TTL loads, or one low power Schottky TTL load
  • Functional equivalent to TTL74175
  • Standardized, symmetrical output characteristics
  • Applications:
    • Shift registers
    • Buffer/storage registers
    • Pattern generators

Cd40175B consists of four identical D-type flip-flops. Each flip-flop has an independent DATA D input and complementary Q and Q\ outputs. The CLOCK and CLEAR inputs are common to all flip-flops. Data are transferred to the Q outputs on the positive-going transition of the clock pulse. All four flip-flops are simultaneously reset by a low level on the CLEAR input.

These devices can function as shift register elements or as T-type flip-flops for toggle and counter applications.

The CD40175B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

Cd40175B consists of four identical D-type flip-flops. Each flip-flop has an independent DATA D input and complementary Q and Q\ outputs. The CLOCK and CLEAR inputs are common to all flip-flops. Data are transferred to the Q outputs on the positive-going transition of the clock pulse. All four flip-flops are simultaneously reset by a low level on the CLEAR input.

These devices can function as shift register elements or as T-type flip-flops for toggle and counter applications.

The CD40175B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, MT and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).
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類型 標題 下載最新的英語版本 日期
* 數據表 CD40175B TYPES 數據表 (Rev. C) 2003年 10月 13日

訂購和質量

包含信息：
  • RoHS
  • REACH
  • 器件標識
  • 引腳鍍層/焊球材料
  • MSL 等級/回流焊峰值溫度
  • MTBF/時基故障估算
  • 材料成分
  • 鑒定摘要
  • 持續可靠性監測
包含信息：
  • 制造廠地點
  • 封裝廠地點

支持和培訓