ADC081000
- Internal Sample-and-Hold
- Single +1.9V ±0.1V Operation
- Adjustable Output Levels
- Ensured No Missing Codes
- Low Power Standby Mode
The ADC081000 is a low power, high performance CMOS analog-to-digital converter that digitizes signals to 8 bits resolution at sampling rates up to 1.6 GSPS. Consuming a typical 1.4 Watts at 1 GSPS from a single 1.9 Volt supply, this device is ensured to have no missing codes over the full operating temperature range. The unique folding and interpolating architecture, the fully differential comparator design, the innovative design of the internal sample-and-hold amplifier and the self-calibration scheme enable a very flat response of all dynamic parameters beyond Nyquist, producing a high 7.5 ENOB with a 500 MHz input signal and a 1 GHz sample rate while providing a 10-18 B.E.R. Output formatting is offset binary and the LVDS digital outputs are compliant with IEEE 1596.3-1996, with the exception of a reduced common mode voltage of 0.8V.
The converter has a 1:2 demultiplexer that feeds two LVDS buses, reducing the output data rate on each bus to half the sampling rate. The data on these buses are interleaved in time to provide a 500 MHz output rate per bus and a combined output rate of 1 GSPS.
The converter typically consumes less than 10 mW in the Power Down Mode and is available in a 128-lead HLQFP and operates over the industrial (–40°C ≤ TA ≤ +85°C) temperature range.
技術文檔
| 類型 | 標題 | 下載最新的英語版本 | 日期 | |||
|---|---|---|---|---|---|---|
| * | 數據表 | ADC081000 High-Performance Low-Power 8-Bit 1-GSPS ADC 數據表 (Rev. G) | 2013年 5月 2日 | |||
| EVM 用戶指南 | AN-1615 LMH6555 Evaluation Board (Rev. A) | 2013年 4月 26日 | ||||
| 應用手冊 | Generating Precision Clocks for Time- Interleaved ADCs | 2007年 8月 2日 | ||||
| 白皮書 | Interleaving ADCs for Higher Sample Rates | 2005年 2月 1日 | ||||
| 白皮書 | Ultra-High Speed ADCs Revolutionize Digital Receiver Design | 2004年 2月 1日 |
設計和開發
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| 封裝 | 引腳 | CAD 符號、封裝和 3D 模型 |
|---|---|---|
| HLQFP (NNB) | 128 | Ultra Librarian |
訂購和質量
- RoHS
- REACH
- 器件標識
- 引腳鍍層/焊球材料
- MSL 等級/回流焊峰值溫度
- MTBF/時基故障估算
- 材料成分
- 鑒定摘要
- 持續可靠性監測
- 制造廠地點
- 封裝廠地點