SNOS413E August 2000 – November 2016 LPV321-N , LPV324-N , LPV358-N
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
1 Features
- Specified 2.7-V and 5-V Performance
- No Crossover Distortion
- Space-Saving Package
- 5-Pin SC70 2 × 2.1 × 1 mm
- Industrial Temperature Range: −40°C to 85°C
- Gain-Bandwidth Product: 152 kHz
- Low Supply Current
- LPV321-N: 9 µA
- LPV358-N: 15 µA
- LPV324-N: 28 µA
- Rail-to-Rail Output Swing at 100 kΩ Load:
- V+ − 3.5 mV
- V− + 90 mV
- VCM, −0.2 V to V+− 0.8 V
2 Applications
- Active Filters
- General-Purpose Low Voltage Applications
- General-Purpose Portable Devices
3 Description
The LPV3xx-N are low power (9-µA per channel at
5 V) versions of the LMV3xx op amps. This is another addition to the LMV family of commodity op amps.
The LPV3xx-N are the most cost effective solutions for the applications where low voltage, low power operation, space saving and low price are needed. The LPV3xx-N have rail-to-rail output swing capability and the input common-mode voltage range includes ground. They all exhibit excellent speed-power ratio, achieving 152 kHz of bandwidth with a supply current of only 9 µA.
The LPV321-N is available in space saving 5-Pin SC70, which is approximately half the size of 5-Pin SOT-23. The small package saves space on PC boards, and enables the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity.
The chips are built with Texas Instruments's advanced submicron silicon-gate BiCMOS process. The LPV3xx-N have bipolar input and output stages for improved noise performance and higher output current drive.
Device Information(1)
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| LPV321-N | SC70 (5) | 2.00 mm × 1.25 mm |
| SOT-23 (5) | 2.90 mm × 1.60 mm | |
| LPV358-N | SOIC (8) | 4.90 mm × 3.91 mm |
| VSSOP (8) | 3.00 mm × 3.00 mm | |
| LPV324-N | SOIC (14) | 8.65 mm × 3.91 mm |
| TSSOP (14) | 5.00 mm × 4.40 mm |
- For all available packages, see the orderable addendum at the end of the data sheet.
Micropower Supply Current
Rail-to-Rail Output Swing
