2 QFN Pinout and Schematic Considerations

The following is a detailed comparison of differences between BGA and QFN packages.

There are no differences from a schematic and pinout standpoint in terms of the number or availability of the high-speed, control/status, and power pins. The only difference in pin count is the number of GND connections. There are 12 balls on the BGA package routed to GND. There are 8 pins and a large thermal pad on the QFN package that are internally routed to GND.