SLVK174 September 2024 TPS7H1121-SP
- 1
- TPS7H1121-SP Single-Event Effects (SEE)
- Trademarks
- 1 Introduction
- 2 Single-Event Effects (SEE)
- 3 Device and Test Board Information
- 4 Irradiation Facility and Setup
- 5 Depth, Range, and LETEFF Calculation
- 6 Test Setup and Procedures
- 7 Destructive Single-Event Effects (DSEE)
- 8 Single-Event Transients (SET)
- 9 Event Rate Calculations
- 10Summary
- A Total Ionizing Dose from SEE Experiments
- B References
3 Device and Test Board Information
The TPS7H1121-SP is packaged in a 22-pin thermally-enhanced ceramic package as shown in Figure 3-1. The TPS7H1121EVM-CVAL evaluation module was used to evaluate the performance and characteristics of the TPS7H1121-SP under heavy ion radiation. The TPS7H1121EVM-CVAL (Evaluation Module) is shown in Figure 3-2. The EVM schematic is shown in Figure 3-3.
![Photograph of Delidded TPS7H1121-SP [Left] and Pinout Diagram [Right]](/ods/images/SLVK174/GUID-20240723-SS0I-PMWH-HRXL-TKIO4CMMSTYO-low.svg "Photograph of Delidded TPS7H1121-SP [Left] and Pinout Diagram [Right]")
Figure 3-1 Photograph of Delidded TPS7H1121-SP [Left] and Pinout Diagram [Right]Note: The package was delidded to reveal the die face for all heavy-ion testing.
Figure 3-2 TPS7H1121-SP EVM Top
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