The TLIN1431x-Q1 has multiple thermal sensors in the device to monitor the junction temperature of the die. The VCC LDO, LIN transmitter, and high side switch/LIMP cells are monitored. The action taken by the device is determined by which cell junction temperature is exceeded. Exceeding the maximum junction temperature for the LIN transmitter or LDO causes the LIN transmitter into the recessive state and turns off the VCC regulator. The nRST pin is pulled to ground during a LIN or VCC LDO TSD event. Once the over temperature fault condition has been removed and the junction temperature has cooled beyond the hysteresis temperature, the transmitter can be re-enabled. Exceeding the max junction temperature of the high side switch or LIMP cells cause the cells to be turned off.

In SPI mode, there are two interrupts that can be set due to a thermal event. If the LIN transceiver or VCC LDO junction temperature is exceeded the TSD_VCC_LIN interrupt is set and the devices taked the action previously described. If the high side switch or LIMP high side switch max junction temperature is exceeded the TSD_HSS_LIMP interrupt is set and the device takes the action previously described. In SPI mode, the device defaults to support fail-safe mode. The device enters fail-safe mode upon a TSD_VCC_LIN event and LIMP is turned on. Exiting fail-safe mode is the same as when the device is pin controlled. When fail-safe mode is disabled the device enters sleep mode upon a TSD_VCC_LIN event.