SFFSAC2 May 2025 TLV9152-Q1
This section provides a failure mode analysis (FMA) for the pins of the TLV9152-Q1 (VSSOP (DGK) | 8, SOIC (D) | 8, and TSSOP (PW) | 8 packages). The failure modes covered in this document include the typical pin-by-pin failure scenarios:
Table 4-2 through Table 4-13 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
| Class | Failure Effects |
|---|---|
| A | Potential device damage that affects functionality. |
| B | No device damage, but loss of functionality. |
| C | No device damage, but performance degradation. |
| D | No device damage, no impact to functionality or performance. |
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section: