SFFS911 December 2024 TMAG5110-Q1 , TMAG5111-Q1
4.2 TMAG5111-Q1
Figure 4-2 shows the TMAG5111-Q1 pin diagram for the DBV package. For a detailed description of the device pins, see the Pin Configuration and Functions section in the TMAG5111-Q1 data sheet.
Figure 4-2 Pin Diagram (DBV Package)Table 4-6 Pin FMA for Device Pins
Short-Circuited to Ground
| Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|
| VCC | 1 | A lot of current can be sourced external to the device, with the current only limited by the source that supplies VCC and the total resistance between the supply and ground. Depending on the layout, a short can conduct enough heat to damage the part. | B or A |
| GND | 2 | Normal, recommended operation. | D |
| NC | 3 | Normal, recommended operation. | D |
| OUT1 | 4 | OUT1 is always low, current is limited and heat dissipation is limited by the external pull-up resistor. | B |
| OUT2 | 5 | OUT2 is always low, current is limited and heat dissipation is limited by the external pull-up resistor. | B |
Table 4-7 Pin FMA for Device Pins
Open-Circuited
| Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|
| VCC | 1 | Device is unresponsive but not damaged. | B |
| GND | 2 | Device is not functional. | B |
| NC | 3 | Normal operation. | D |
| OUT1 | 4 | Device output is disconnected from the system. Device is not damaged, functionality within the system is lost until open fixed. | B |
| OUT2 | 5 | Device output is disconnected from the system. Device is not damaged, functionality within the system is lost until open fixed. | B |
Table 4-8 Pin FMA for Device Pins
Short-Circuited to Adjacent Pin
| Pin Name | Pin No. | Shorted to | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|---|
| VCC | 1 | GND | A lot of current can be sourced external to the device, with the current only limited by the source that supplies VCC and the total resistance between the supply and ground. Depending on the layout, a short can conduct enough heat to damage the part. | B or A |
| GND | 2 | NC | Normal, recommended operation. | D |
| NC | 3 | OUT1 | Functional, however, not recommended | D |
| OUT1 | 4 | OUT2 | Erroneous output. OUT1 and OUT2 are dominated by whichever is in the low state. Functionality is lost and increased consumption of current is possible. | B |
| OUT2 | 5 | VCC | Device OUT2 is stuck high, the worst-case current is only limited by output drain RDS(on). If on sufficiently long, the output can be damaged. | B or A |
Table 4-9 Pin FMA for Device Pins
Short-Circuited to
VCC
| Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|
| VCC | 1 | Normal Operation. | D |
| GND | 2 | A lot of current can be sourced external to the device, with the current only limited by the source that supplies VCC and the total resistance between the supply and ground. Depending on the layout, a short can conduct enough heat to damage the part. | B or A |
| NC | 3 | Not recommended, however, the part is expected to maintain functionality and not be damaged. | D |
| OUT1 | 4 | Device OUT1 is stuck high, the worst-case current is only limited by output drain RDS(on). If on sufficiently long, the output can be damaged. | B or A |
| OUT2 | 5 | Device OUT2 is stuck high, the worst-case current is only limited by output drain RDS(on). If on sufficiently long, the output can be damaged. | B or A |