SFFS525A September 2022 – November 2022 UCC28C50 , UCC28C51 , UCC28C52 , UCC28C53 , UCC28C54 , UCC28C55 , UCC28C56L , UCC28C57H , UCC28C57L , UCC28C58 , UCC28C59
This section provides functional safety failure in time (FIT) rates for the VSSOP (8) package of the UCCx8C5x based on two different industry-wide used reliability standards:
| FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
|---|---|
| Total component FIT rate (71.6 mW, 150 mW, 300 mW) | 8, 9, 15 |
| Die FIT rate (71.6 mW, 150 mW, 300 mW) | 4, 5, 11 |
| Package FIT rate (71.6 mW, 150 mW, 300 mW) | 4, 4, 4 |
The failure rate and mission profile information in Table 2-3 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
| Table | Category | Reference FIT Rate | Reference Virtual TJ |
|---|---|---|---|
| 5 | CMOS,
BICMOS Digital, analog, or mixed |
25 FIT | 55°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table 2-4 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.