SFFS178 February 2022 AMC1306M05-Q1
The failure mode distribution estimation for the AMC1306M05-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity, and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.
| Die Failure Modes | Failure Mode Distribution (%) |
|---|---|
| DOUT stuck high or low | 45% |
| Bitstream output out of specification (equivalent to gain error) | 15% |
| Device behavior undetermined | 15% |
| Reduced CMTI performance | 10% |
| Bitstream output out of specification (equivalent to offset error) | 10% |
| Bitstream output out of specification (increased noise) | 5% |
The FMD in Table 3-1 excludes short-circuit faults across the isolation barrier. Faults for short circuits across the isolation barrier can be excluded according to ISO 61800-5-2:2016 if the following requirements are fulfilled:
Apply creepage and clearance requirements according to the specific equipment isolation standards of an application. Care must be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance.