SBAA447 September 2021 AMC1302-Q1
The failure mode distribution estimation for the AMC1302-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity and from best engineering judgment.
The failure modes listed in this section reflect random failure events and do not include failures due to misuse or overstress.
| Die Failure Modes | Failure Mode Distribution (%) |
|---|---|
| Output out of specification (gain error) | 20% |
| Output out of specification (offset error) | 20% |
| Output out of specification (differential output at positive or negative full-scale) | 20% |
| OUTN stuck high or low | 10% |
| OUTP stuck high or low | 10% |
| Reduced CMTI performance | 9% |
| Output out of specification (spikes, increased noise) | 5% |
| Device behavior undetermined | 5% |
| Output failsafe function fails to indicate an error(1) | 1% |
The FMD in Table 3-1 excludes short circuit faults across the isolation barrier. Faults for short circuit across the isolation barrier can be excluded according to ISO 61800-5-2:2016 if the following requirements are fulfilled:
Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed-circuit board do not reduce this distance.