ZHCSGC2I June 2017 – March 2024 UCC5310 , UCC5320 , UCC5350 , UCC5390
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Device Comparison Table
- 5 Pin Configuration and Function
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Ratings
- 6.6 Insulation Specifications for D Package
- 6.7 Insulation Specifications for DWV Package
- 6.8 Safety-Related Certifications For D Package
- 6.9 Safety-Related Certifications For DWV Package
- 6.10 Safety Limiting Values
- 6.11 Electrical Characteristics
- 6.12 Switching Characteristics
- 6.13 Insulation Characteristics Curves
- 6.14 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Revision History
- 14Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
11.2 Layout Example
Figure 11-1 shows a PCB layout example with the signals and key components labeled.
A. No PCB traces or copper are
located between the primary and secondary side, which ensures isolation
performance.
Figure 11-1 Layout ExampleFigure 11-2 and Figure 11-3 show the top and bottom layer traces and copper.
Figure 11-2 Top-Layer Traces and
Copper
Figure 11-3 Bottom-Layer Traces and Copper
(Flipped)Figure 11-4 shows the 3D layout of the top view of the PCB.
A. The location of the PCB cutout
between primary side and secondary sides ensures isolation performance.
Figure 11-4 3-D PCB View