ZHCSGC2I June 2017 – March 2024 UCC5310 , UCC5320 , UCC5350 , UCC5390
PRODUCTION DATA
- 1
- 1 特性
- 2 應(yīng)用
- 3 說(shuō)明
- 4 Device Comparison Table
- 5 Pin Configuration and Function
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Ratings
- 6.6 Insulation Specifications for D Package
- 6.7 Insulation Specifications for DWV Package
- 6.8 Safety-Related Certifications For D Package
- 6.9 Safety-Related Certifications For DWV Package
- 6.10 Safety Limiting Values
- 6.11 Electrical Characteristics
- 6.12 Switching Characteristics
- 6.13 Insulation Characteristics Curves
- 6.14 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Revision History
- 14Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤(pán)機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購(gòu)信息
8.2 Functional Block Diagram
Figure 8-1 Conceptual Block Diagram of a Capacitive Data
Channel
Figure 8-2 On-Off Keying (OOK) Based Modulation
Scheme
Figure 8-3 Functional Block Diagram — Split Output
(UCC53x0S)
Figure 8-4 Functional Block Diagram — Miller Clamp (UCC53x0M)
Figure 8-5 Functional Block Diagram — UVLO With Respect to
GND2 (UCC53x0E)