ZHCSH21A October   2017  – February 2018 UCC28780

PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用
3. 3 說(shuō)明
   1.     Device Images
      1.      簡(jiǎn)化原理圖
      2.      45W、20V GaN-ACF 適配器效率
4. 4 修訂歷史記錄
5. 5 Pin Configuration and Functions
   1.     Pin Functions
6. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Recommended Operating Conditions
   4. 6.4 Thermal Information of SOIC
   5. 6.5 Thermal Information of WQFN
   6. 6.6 Electrical Characteristics
   7. 6.7 Typical Characteristics
7. 7 Detailed Description
   1. 7.1 Overview
   2. 7.2 Functional Block Diagram
   3. 7.3 Detailed Pin Description
      1. 7.3.1 BUR Pin (Programmable Burst Mode)
      2. 7.3.2 FB Pin (Feedback Pin)
      3. 7.3.3 VDD Pin (Device Bias Supply)
      4. 7.3.4 REF Pin (Internal 5-V Bias)
      5. 7.3.5 HVG and SWS Pins
      6. 7.3.6 RTZ Pin (Sets Delay for Transition Time to Zero)
      7. 7.3.7 RDM Pin (Sets Synthesized Demagnetization Time for ZVS Tuning)
      8. 7.3.8 RUN Pin (Driver Enable Pin)
      9. 7.3.9 SET Pin
   4. 7.4 Device Functional Modes
      1. 7.4.1  Adaptive ZVS Control with Auto-Tuning
      2. 7.4.2  Dead-Time Optimization
      3. 7.4.3  Control Law across Entire Load Range
      4. 7.4.4  Adaptive Amplitude Modulation (AAM)
      5. 7.4.5  Adaptive Burst Mode (ABM)
      6. 7.4.6  Low Power Mode (LPM)
      7. 7.4.7  Standby Power Mode (SBP)
      8. 7.4.8  Startup Sequence
      9. 7.4.9  Survival Mode of VDD
      10. 7.4.10 System Fault Protections
          1. 7.4.10.1 Brown-In and Brown-Out
          2. 7.4.10.2 Output Over-Voltage Protection
          3. 7.4.10.3 Over-Temperature Protection
          4. 7.4.10.4 Programmable Over-Power Protection
          5. 7.4.10.5 Peak Current Limit
          6. 7.4.10.6 Output Short-Circuit Protection
          7. 7.4.10.7 Over-Current Protection
          8. 7.4.10.8 Thermal Shutdown
      11. 7.4.11 Pin Open/Short Protections
          1. 7.4.11.1 Protections on CS pin Fault
          2. 7.4.11.2 Protections on HVG pin Fault
          3. 7.4.11.3 Protections on RDM and RTZ pin Faults
8. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application Circuit
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 Input Bulk Capacitance and Minimum Bulk Voltage
         2. 8.2.2.2 Transformer Calculations
            1. 8.2.2.2.1 Primary-to-Secondary Turns Ratio (NPS)
            2. 8.2.2.2.2 Primary Magnetizing Inductance (LM)
            3. 8.2.2.2.3 Primary Turns (NP)
            4. 8.2.2.2.4 Secondary Turns (NS)
            5. 8.2.2.2.5 Turns of Auxiliary Winding (NA)
            6. 8.2.2.2.6 Winding and Magnetic Core Materials
         3. 8.2.2.3 Clamp Capacitor Calculation
         4. 8.2.2.4 Bleed-Resistor Calculation
         5. 8.2.2.5 Output Filter Calculation
         6. 8.2.2.6 Calculation of ZVS Sensing Network
         7. 8.2.2.7 Calculation of Compensation Network
      3. 8.2.3 Application Curves
9. 9 Power Supply Recommendations
10. 10Layout
    1. 10.1 Layout Guidelines
       1. 10.1.1 General Considerations
       2. 10.1.2 RDM and RTZ Pins
       3. 10.1.3 SWS Pin
       4. 10.1.4 VS Pin
       5. 10.1.5 BUR Pin
       6. 10.1.6 FB Pin
       7. 10.1.7 CS Pin
       8. 10.1.8 GND Pin
    2. 10.2 Layout Example
11. 11器件和文檔支持
    1. 11.1 文檔支持
       1. 11.1.1 相關(guān)文檔
    2. 11.2 接收文檔更新通知
    3. 11.3 社區(qū)資源
    4. 11.4 商標(biāo)
    5. 11.5 靜電放電警告
    6. 11.6 Glossary
12. 12機(jī)械、封裝和可訂購(gòu)信息