over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
|
MIN |
MAX |
UNIT |
| Supply voltage, VDD |
–0.3 |
20 |
V |
| Output Voltage, OUTA, OUTB |
DC |
–0.3 |
VDD +0.3 |
V |
| 100ns Pulse |
–2 |
VDD +0.3 |
V |
| Input Voltage INA, INB, |
–5 |
VDD+0.3 |
V |
| Input Voltage ENA, ENB |
-0.3
|
VDD+0.3
|
V
|
| Operating junction temperature, TJ |
–40 |
150 |
°C |
| Lead temperature |
Soldering, 10 sec. |
|
300 |
°C |
| Reflow |
|
260 |
| Storage temperature, Tstg |
–65 |
150 |
°C |
(1) Operation outside the Absolute Maximum Ratings may cause
permanent device damage. Absolute Maximum Ratings do not imply functional
operation of the device at these or any other conditions beyond those listed
under Recommended Operating Conditions. If outside the Recommended Operating
Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance,
and shorten the device lifetime.
(2) All voltages are with respect to GND unless otherwise noted.
Currents are positive into, negative out of the specified terminal. See
Section 6.4 of the datasheet for thermal limitations and considerations of
packages.
(3) These devices are sensitive to electrostatic discharge; follow
proper device handling procedures.