ZHCSPQ0A may 2022 – july 2023 UCC27444-Q1
PRODUCTION DATA
| THERMAL METRIC | UCC27444-Q1 | UNIT | ||
|---|---|---|---|---|
| DGN | D | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 57.3 | 131.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 82.0 | 73.4 | |
| RθJB | Junction-to-board thermal resistance | 30.5 | 74.6 | |
| ψJT | Junction-to-top characterization parameter | 5.0 | 25.6 | |
| ψJB | Junction-to-board characterization parameter | 30.4 | 73.8 | |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 13.1 | n/a | |