| PACKAGE | θJC (°C/W) | θJA (°C/W) | POWER RATING TA = 70°C (mW)(1) |
|---|
| D (SOIC-8) | 42 | 84 to 160(2) | 344 to 655(2) |
| DGN (MSOP PowerPAD)(3) | 11.9 | 63 | 873 |
(1) 125°C operating junction temperature is used for power rating calculations.
(2) The range of values indicates the effect of the PCB. These values are intended to give the system designer an indication of the best- and worst-case conditions. In general, the system designer should attempt to use larger traces on the PCB, where possible, to spread the heat away form the device more effectively.
(3) The PowerPAD is not directly connected to any leads of the package. However, it is electronically and thermally connected to the substrate which is the ground of the device.