ZHCSTY3I September 2008 – November 2023 UCC27423-Q1 , UCC27424-Q1 , UCC27425-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | UCC2742x-Q1 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DGN (MSOP With PowerPAD) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 112.6 | 63 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 61.5 | 53.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 52.8 | 35.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 15.8 | 1.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 52.3 | 35.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | 11.9 | °C/W |