ZHCSIU2K June 2001 – November 2023 UCC27323 , UCC27324 , UCC27325 , UCC37323 , UCC37324 , UCC37325
PRODUCTION DATA
| THERMAL METRIC(1) | UCCx732x | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | DGN (MSOP With PowerPAD) | P (PDIP) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 107.3 | 56.6 | 55.5 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 52.2 | 52.8 | 45.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 47.3 | 32.6 | 32.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 10.2 | 1.8 | 23 | °C/W |
| ψJB | Junction-to-board characterization parameter | 46.8 | 32.3 | 32.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 5.9 | N/A | °C/W |