ZHCSL22B March 2020 – May 2022 UCC27284-Q1
PRODUCTION DATA
| PIN | I/O(1) | DESCRIPTION | ||
|---|---|---|---|---|
| Name | D | DDA | ||
| HB | 2 | 2 | P | High-side bootstrap supply. The bootstrap diode is on-chip but the external bootstrap capacitor is required. Connect positive side of the bootstrap capacitor to this pin. Typical recommended value of HB bypass capacitor is 0.1 μF, This value primarily depends on the gate charge of the high-side MOSFET. When using external boot diode, connect cathode of the diode to this pin. |
| HI | 5 | 5 | I | High-side input. |
| HO | 3 | 3 | O | High-side output. Connect to the gate of the high-side power MOSFET or one end of external gate resistor, when used. |
| HS | 4 | 4 | P | High-side source connection. Connect to source of high-side power MOSFET. Connect negative side of bootstrap capacitor to this pin. |
| LI | 6 | 6 | I | Low-side input |
| LO | 8 | 8 | O | Low-side output. Connect to the gate of the low-side power MOSFET or one end of external gate resistor, when used. |
| VDD | 1 | 1 | P | Positive supply to the low-side gate driver. Decouple this pin to VSS. Typical decoupling capacitor value is 1 μF. When using an external boot diode, connect the anode to this pin. |
| Thermal Pad | n/a | Pad | - | Connect to a large thermal mass trace (generally IC ground plane, VSS) to improve thermal performance. This can only be electrically connected to VSS. |