ZHCSJ23C November 2018 – September 2019 UCC20225-Q1 , UCC20225A-Q1
PRODUCTION DATA.
- 1 特性
- 2 應用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configuration and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 ESD Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Power Ratings
- 6.6 Insulation Specifications
- 6.7 Safety-Related Certifications
- 6.8 Safety Limiting Values
- 6.9 Electrical Characteristics
- 6.10 Switching Characteristics
- 6.11 Thermal Derating Curves
- 6.12 Typical Characteristics
- 7 Parameter Measurement Information
- 8 Detailed Description
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1 Design Requirements
- 9.2.2
Detailed Design Procedure
- 9.2.2.1 Designing PWM Input Filter
- 9.2.2.2 Select External Bootstrap Diode and its Series Resistor
- 9.2.2.3 Gate Driver Output Resistor
- 9.2.2.4 Estimate Gate Driver Power Loss
- 9.2.2.5 Estimating Junction Temperature
- 9.2.2.6 Selecting VCCI, VDDA/B Capacitor
- 9.2.2.7 Dead Time Setting Guidelines
- 9.2.2.8 Application Circuits with Output Stage Negative Bias
- 9.2.3 Application Curves
- 10Power Supply Recommendations
- 11Layout
- 12器件和文檔支持
- 13機械、封裝和可訂購信息
9.2.2.5 Estimating Junction Temperature
The junction temperature (TJ) of the UCC20225-Q1 family can be estimated with:
where
- TC is the UCC20225-Q1 family case-top temperature measured with a thermocouple or some other instrument, and
- ΨJT is the Junction-to-top characterization parameter from the Thermal Information table.
Using the junction-to-top characterization parameter (ΨJT) instead of the junction-to-case thermal resistance (RΘJC) can greatly improve the accuracy of the junction temperature estimation. The majority of the thermal energy of most ICs is released into the PCB through the package leads, whereas only a small percentage of the total energy is released through the top of the case (where thermocouple measurements are usually conducted). RΘJC can only be used effectively when most of the thermal energy is released through the case, such as with metal packages or when a heatsink is applied to an IC package. In all other cases, use of RΘJC will inaccurately estimate the true junction temperature. ΨJT is experimentally derived by assuming that the amount of energy leaving through the top of the IC will be similar in both the testing environment and the application environment. As long as the recommended layout guidelines are observed, junction temperature estimates can be made accurately to within a few degrees Celsius. For more information, see the Semiconductor and IC Package Thermal Metrics application report.