ZHCSFQ2C November 2016 – June 2018 TUSB422
PRODUCTION DATA.
請參考 PDF 數(shù)據(jù)表獲取器件具體的封裝圖。
| THERMAL METRIC(1) | TUSB422 | UNIT | |
|---|---|---|---|
| YFF (DSBGA) | |||
| 9 PINS | |||
| RΘJA | Junction-to-ambient thermal resistance | 114.3 | °C/W |
| RΘJC(top) | Junction-to-case (top) thermal resistance | 0.7 | °C/W |
| RΘJB | Junction-to-board thermal resistance | 24.9 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 24.9 | °C/W |
| RΘJC(bot) | Junction-to-case (bottom) thermal resistance | NA | °C/W |