ZHCSCV1A June 2014 – July 2014 TSC2013-Q1
PRODUCTION DATA.
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 修訂歷史記錄
- 5 Pin Configurations and Functions
-
6 Specifications
- 6.1 Absolute Maximum Ratings
- 6.2 Handling Ratings
- 6.3 Recommended Operating Conditions
- 6.4 Thermal Information
- 6.5 Electrical Characteristics
- 6.6 Timing Requirements — I2C Standard Mode (?(SCL) = 100 kHz)
- 6.7 Timing Requirements — I2C Fast Mode (?(SCL) = 400 kHz)
- 6.8 Timing Requirements — I2C High-Speed Mode (?(SCL) = 1.7 MHz)
- 6.9 Timing Requirements — I2C High-Speed Mode (?(SCL) = 3.4 MHz)
- 6.10 Typical Characteristics
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3 Feature Description
- 7.4 Device Functional Modes
- 7.5 Programming
- 7.6
Register Maps
- 7.6.1 Configuration and Status Registers
- 7.6.2 Data Registers
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2 Detailed Design Procedure
- 8.2.3 Application Curves
- 9 Power Supply Recommendations
- 10Layout
- 11器件和文檔支持
- 12機械封裝和可訂購信息
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
- RSA|16
訂購信息
11 器件和文檔支持
11.1 商標
All other trademarks are the property of their respective owners.
11.2 靜電放電警告
這些裝置包含有限的內(nèi)置 ESD 保護。 存儲或裝卸時，應(yīng)將導(dǎo)線一起截短或?qū)⒀b置放置于導(dǎo)電泡棉中，以防止 MOS 門極遭受靜電損傷。