9 Revision History
Changes from Revision D (September 2019) to Revision E (July 2024)
- 更新了整個文檔中的表格、圖和交叉參考的編號格式Go
- Changed ESD HBM performance testing standard from: JESD 22 to:
JEDEC JS-001Go
- Changed ESD CDM performance testing standard from: JESD22-C101 to:
JEDEC JS-002Go
- Added tablenote to the Data input/output voltage
parameterGo
- Changed RSE (UQFN) junction-to-ambient thermal resistance value from:
169.8°C/W to: 204.8°C/WGo
- Changed RSE (UQFN) junction-to-case (top) thermal resistance value from:
84.7°C/W to: 118.1°C/WGo
- Changed RSE (UQFN) junction-to-board thermal resistance value from: 94.9°C/W
to: 121.5°C/WGo
- Changed RSE (UQFN) junction-to-top characterization parameter value from:
5.7°C/W to: 13.9°C/WGo
- Changed RSE (UQFN) junction-to-board characterization parameter value from:
94.9°C/W to: 121.2°C/WGo
- Changed the VIK value
in the Electrical Characteristics table from: –1.8V maximum to: –1.8V
minimumGo
- Changed the graphs in the Typical Characteristics
sectionGo
Changes from Revision C (April 2015) to Revision D (September 2019)
- 將 VCC 工作范圍從 2.5V 至 3.3V 更改為 2.3V 至 3.6VGo
Changes from Revision B (July 2012) to Revision C (April 2015)
- 添加了引腳配置和功能 部分、ESD 等級 表、熱性能信息 表、特性說明 部分、器件功能模式、應(yīng)用和實施 部分、電源相關(guān)建議 部分、布局 部分、器件和文檔支持 部分以及機(jī)械、封裝和可訂購信息 部分Go
- 刪除了訂購信息 表Go
Changes from Revision A (February 2010) to Revision B (July 2012)
- 更新了訂購信息 表中 RSE 封裝的頂部標(biāo)記Go