ZHCSDL6C November 2014 – March 2019 TS3DDR4000
PRODUCTION DATA.
| THERMAL METRIC(1) | TS3DDR4000 | UNIT | |
|---|---|---|---|
| BGA (48) | |||
| RθJA | Junction-to-ambient thermal resistance | 92.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 33.4 | |
| RθJB | Junction-to-board thermal resistance | 56.2 | |
| ψJT | Junction-to-top characterization parameter | 1.3 | |
| ψJB | Junction-to-board characterization parameter | 54.9 | |