6.4 Thermal Information: TS321
| THERMAL METRIC(1)(2)(3) |
TS321 |
UNIT |
| D (SOIC) |
DBV (SOT-23) |
| 5 PINS |
5 PINS |
| RθJA |
Junction-to-ambient thermal resistance |
97 |
206 |
°C/W |
(2) Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = [TJ(max) – TA] / qJA. Selecting the maximum of 150°C can effect reliability.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.