10 Revision History
Changes from Revision B (June 2021) to Revision C (December 2024)
- 將器件信息 表更改為封裝信息 表Go
- 向數據表中添加了 SOT-23-THN (DYY) 封裝Go
- Added Note 2 to the ESD Protection, Driver
Go
- Added Note 2 to the ESD
Protection, Receiver
Go
Changes from Revision A (December 2020) to Revision B (June 2021)
- 添加了應用工業 PC、有線網絡、數據中心和企業級計算Go
- Changed the table note in the ESD Protection, Driver table to make it
applicable to D and PW packages.Go
- Changed the table note in the ESD Protection, Reciever table to make it
applicable to D and PW packagesGo
- Changed the thermal parameter values for D and PW packages in the Thermal Information tableGo
Changes from Revision * (August 2007) to Revision A (December 2020)
- 添加了“器件信息”表、“ESD 等級”表、“特性說明”部分、“器件功能模式”、“應用和實施”部分、“電源相關建議”部分、“布局”部分、“器件和文檔支持”部分以及“機械、封裝和可訂購信息”部分Go
- Added Note to the ESD Protection, Driver
Go
- Added Note to the ESD Protection, Receiver
Go
- Added tsk(p) row for RGT package in the Switching Characteristics,
DriverGo
- Added tPLH and tPHL rows for RGT package in the Switching
Characteristics, Reveiver
Go
- Added tsk(p) row for RGT package in the Switching Characteristics,
Reveiver
Go