ZHCSR83C March 2023 – January 2024 TPSM863252 , TPSM863253 , TPSM863257
PRODUCTION DATA
| THERMAL METRIC(1) | TPSM86325x | UNIT | |
|---|---|---|---|
| RDX | |||
| 7 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 61.3 | °C/W |
| RθJA_effective | Junction-to-ambient thermal resistance on EVM board | 40(2) | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 60.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 20.0 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 7.5 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 19.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |