6.1 Absolute Maximum Ratings
Over operating ambient temperature range (unless otherwise noted)(1)
|
MIN |
MAX |
UNIT |
| Input voltage |
VIN |
–0.3 |
19 |
V |
| EN, PGOOD, SS/TRK, RT/CLK, FB |
–0.3 |
6.5 |
V |
| AGND to PGND |
–0.3 |
0.3 |
V |
| Output voltage |
SW |
–1 |
VIN + 1 |
V |
| SW (< 10-ns transients) |
–3 |
VIN + 3 |
V |
| VOUT |
–0.3 |
VIN |
V |
| Mechanical shock |
Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted |
|
500 |
G |
| Mechanical vibration |
Mil-STD-883D, Method 2007.2, 20 to 2000 Hz |
|
10 |
G |
| Operating IC junction temperature, TJ(2) |
–40 |
150 |
°C |
| Operating ambient temperature, TA(2) |
–40 |
105 |
°C |
| Storage temperature, Tstg |
–40 |
150 |
°C |
(1) Stresses beyond those listed under
Absolute Maximum Ratings may cause permanent damage to the device. Theseare stress ratings only, which do not imply functional operation of the device at these or anyother conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extendedperiods may affect device reliability.
(2) The ambient temperature is the air temperature of the surroundingenvironment. The junction temperature is the temperature of the internal power IC when the deviceis powered. Operating below the maximum ambient temperature, as shown in the safe operatingarea(SOA) curves in the typical characteristics sections, ensures that the maximum junctiontemperature of any component inside the module is never exceeded.