ZHCSN72 june 2023 TPSI2072-Q1
PRODUCTION DATA
| THERMAL METRIC (1) | DEVICE | UNIT | |
|---|---|---|---|
| DWQ (SOIC) | |||
| 11 PINS | |||
| R?JA | Junction-to-ambient thermal resistance | 70 | °C/W |
| R?JA, EVM, 60S | Junction-to-ambient thermal resistance(2)(3) | 52 | °C/W |
| R?JA, EVM, 5S | Junction-to-ambient thermal resistance(2)(4) | 30 | °C/W |
| R?JB | Junction-to-board thermal resistance | 22 | °C/W |
| R?JC(top) | Junction-to-case (top) thermal resistance | 26 | °C/W |
| ψJT | Junction-to-top characterization parameter | 14 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 21 | °C/W |