Thermal dissipation is the primary consideration
for TPS92620-Q1 layout.
- TI recommends large thermal dissipation area in
both top and bottom layers of PCB. The copper pouring area in same layer with
TPS92620-Q1-Q1 footprint must directly cover
the thermal pad land of the device with wide connection as much as possible. The
copper pouring in opposite PCB layer or inner layers must be connected to
thermal pad directly through multiple thermal vias.
- TI recommends to place R(RESx)
resistors away from the TPS92620-Q1 device with
more than 20-mm distance, because R(RESx) resistors are dissipating
some amount of the power as well as the TPS92620-Q1. Place two heat source components apart to reduce the thermal
accumulation concentrated at small PCB area. The large copper pouring area is
also required surrounding the R(RESx) resistors for helping thermal
dissipating.
The noise immunity is the secondary consideration
for TPS92620-Q1 layout.
- TI recommends to place the noise decoupling capacitors for SUPPLY pin as close as possible to the pins.
- TI recommends to place the R(SNSx) resistor as close as possible to the INx pins with the shortest PCB track to SUPPLY pin.