ZHCSO27B May 2021 – December 2022 TPS7H4002-SP
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1 VIN and Power VIN Pins (VIN and PVIN)
- 7.3.2 Voltage Reference
- 7.3.3 Adjusting the Output Voltage
- 7.3.4 Safe Start-Up Into Prebiased Outputs
- 7.3.5 Error Amplifier
- 7.3.6 Slope Compensation
- 7.3.7 Enable and Adjust UVLO
- 7.3.8 Adjustable Switching Frequency and Synchronization (SYNC)
- 7.3.9 Slow Start (SS/TR)
- 7.3.10 Power Good (PWRGD)
- 7.3.11 Sequencing (SS/TR)
- 7.3.12 Output Overvoltage Protection (OVP)
- 7.3.13 Overcurrent Protection
- 7.3.14 Thermal Shutdown
- 7.3.15 Turn-On Behavior
- 7.3.16 Small Signal Model for Frequency Compensation
- 7.4 Device Functional Modes
-
8 Application and Implementation
- 8.1 Application Information
- 8.2
Typical Application
- 8.2.1 Design Requirements
- 8.2.2
Detailed Design Procedure
- 8.2.2.1 Operating Frequency
- 8.2.2.2 Output Inductor Selection
- 8.2.2.3 Output Capacitor Selection
- 8.2.2.4 Output Schottky Diode
- 8.2.2.5 Slow Start Capacitor Selection
- 8.2.2.6 Undervoltage Lockout (UVLO) Set Point
- 8.2.2.7 Output Voltage Feedback Resistor Selection
- 8.2.2.8 Compensation Component Selection
- 8.2.3 Parallel Operation
- 8.2.4 Application Curve
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
11.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |