ZHCSSO5A July 2023 – October 2023 TPS7H2140-SEP
PRODUCTION DATA
- 1
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3 Feature Description
- 8.4 Device Functional Modes
- 9 Application and Implementation
- 10Device and Documentation Support
- 11Mechanical, Packaging, and Orderable Information
9.4.2.2 With a GND Network
With a GND network, tie the thermal pad as one trace to the board GND copper.
Figure 9-8 Layout
Example With a GND Network