SBVS463 October 2025 TPS7E81-Q1
ADVANCE INFORMATION
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Detailed Description
-
7 Application and Implementation
- 7.1
Application Information
- 7.1.1 Adjustable Device Feedback Resistor Selection
- 7.1.2 Recommended Capacitor Types
- 7.1.3 Input and Output Capacitor Selection
- 7.1.4 Reverse Current
- 7.1.5 Feed-Forward Capacitor
- 7.1.6 Dropout Voltage
- 7.1.7 Estimating Junction Temperature
- 7.1.8 Power Dissipation (PD)
- 7.1.9 Power Dissipation Versus Ambient Temperature
- 7.2 Typical Application
- 7.3 Power Supply Recommendations
- 7.4 Layout
- 7.1
Application Information
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
封裝選項
機械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機械數(shù)據(jù) (封裝 | 引腳)
訂購信息
8.6 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |