ZHCSBA4E May 2013 – August 2014 TPS7A8300
PRODUCTION DATA.
評估模塊 (EVM) 可與 TPS7A8300 配套使用,幫助評估初始電路性能。 有關此固定裝置的相關摘要信息,請參見Table 5。
您可以在德州儀器 (TI) 網站上的 TPS7A8300 產品文件夾中獲取 EVM。
分析模擬電路和系統的性能時,使用 SPICE 模型對電路性能進行計算機仿真非常有用。 您可以從 TPS7A8300 產品文件夾中的仿真模型下獲取 TPS7A830 的 SPICE 模型。
| 產品 | 說明 |
|---|---|
| TPS7A8300YYYZ | YYY 為封裝標識符。 Z 為封裝數量。 |
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.