SBVS121E August 2010 – May 2015 TPS7A49
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
-
9 Application and Implementation
- 9.1
Application Information
- 9.1.1 Adjustable Operation
- 9.1.2 Capacitor Recommendations
- 9.1.3 Input and Output Capacitor Requirements
- 9.1.4 Noise-Reduction and Feed-Forward Capacitor Requirements
- 9.1.5 Maximum AC Performance
- 9.1.6 Output Noise
- 9.1.7 Post DC-DC Converter Filtering
- 9.1.8 Power-Supply Rejection
- 9.1.9 Transient Response
- 9.1.10 Audio Applications
- 9.1.11 Power for Precision Analog
- 9.2 Typical Application
- 9.3 Do's and Don’ts
- 9.1
Application Information
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項
機械數據 (封裝 | 引腳)
散熱焊盤機械數據 (封裝 | 引腳)
訂購信息
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Voltage | IN pin to GND pin | –0.3 | 36 | V |
| OUT pin to GND pin | –0.3 | 33 | V | |
| OUT pin to IN pin | –36 | 0.3 | V | |
| FB pin to GND pin | –0.3 | 2 | V | |
| FB pin to IN pin | –36 | 0.3 | V | |
| EN pin to IN pin | –36 | 0.3 | V | |
| EN pin to GND pin | –0.3 | 36 | V | |
| NR/SS pin to IN pin | –36 | 0.3 | V | |
| NR/SS pin to GND pin | –0.3 | 2 | V | |
| Current | Peak output | Internally limited | ||
| Temperature | Operating virtual junction, TJ | –40 | 125 | °C |
| Storage, Tstg | –65 | 150 | °C | |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±1500 | V |
| Charged device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VIN | Input supply voltage | 3 | 35 | V | |
| VEN | Enable supply voltage | 0 | VIN | V | |
| VOUT | Output voltage | VFB | 33 | V | |
| IOUT | Output current | 0 | 150 | mA | |
| TJ | Operating junction temperature | –40 | 125 | °C | |
| CIN | Input capacitor | 2.2 | 10 | µF | |
| COUT | Output capacitor | 2.2 | 10 | µF | |
| CNR | Noise reduction capacitor | 0 | 10 | nF | |
| CFF | Feed-forward capacitor | 0 | 10 | nF | |
| R2 | Lower feedback resistor | 237 | kΩ | ||
6.4 Thermal Information
| THERMAL METRIC(1) | TPS7A49 | UNIT | ||
|---|---|---|---|---|
| DGN (HVSSOP PowerPAD) |
DRB (VSON) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 63.4 | 47.7 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 53 | 55.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 37.4 | 23.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.7 | 1.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 37.1 | 23.5 | °C/W |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | 13.5 | 7.0 | °C/W |
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
At TJ = –40°C to 125°C, VIN = VOUT(nom) + 1 V or VIN = 3 V (whichever is greater), VEN = VIN, IOUT = 1 mA, CIN = 2.2 μF, COUT = 2.2 μF, CNR/SS = 0 nF, and the FB pin tied to OUT, unless otherwise noted. Typical values are at TA = 25°C.| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||
|---|---|---|---|---|---|---|---|---|
| VIN | Input voltage range | 3 | 35 | V | ||||
| VREF | Internal reference(4) | TJ = 25°C, VNR/SS = VREF | 1.176 | 1.188 | 1.212 | V | ||
| VFB | Feedback voltage | 1.185 | V | |||||
| VOUT | Output voltage range(1) | VIN ≥ VOUT(nom) + 1 V | VREF | 33 | V | |||
| Nominal accuracy | TJ = 25°C, VIN = VOUT(nom) + 0.5 V | –1.5 | 1.5 | %VOUT | ||||
| Overall accuracy | VOUT(nom) + 1 V ≤ VIN ≤ 35 V, 1 mA ≤ IOUT ≤ 150 mA |
–2.5 | 2.5 | %VOUT | ||||
 |
Line regulation | TJ = 25°C, VOUT(nom) + 1 V ≤ VIN ≤ 35 V | 0.086 | %VOUT | ||||
 |
Load regulation | TJ = 25°C, 1 mA ≤ IOUT ≤ 150 mA | 0.04 | %VOUT | ||||
| VDO | Dropout voltage | VIN = 95% VOUT(nom), IOUT = 100 mA | 260 | mV | ||||
| VIN = 95% VOUT(nom), IOUT = 150 mA | 333 | 600 | mV | |||||
| ILIM | Current limit | VOUT = 90% VOUT(nom) | 220 | 309 | 500 | mA | ||
| IGND | Ground current | IOUT = 0 mA | 49 | 100 | μA | |||
| IOUT = 100 mA | 800 | μA | ||||||
| ISHDN | Shutdown supply current | VEN = 0.4 V | 0.8 | 3 | μA | |||
| IFB | Feedback current(2) | 3 | 100 | nA | ||||
| IEN | Enable current | VEN = VIN = VOUT(nom) + 1 V | 0.02 | 1 | μA | |||
| VEN = VIN = 35 V | 0.2 | 1 | μA | |||||
| VEN(high) | Enable high-level voltage | 2.1 | VIN | V | ||||
| VEN(low) | Enable low-level voltage | 0 | 0.4 | V | ||||
| Vn | Output noise voltage | VIN = 3 V, VOUT(nom) = VREF, COUT = 10 μF, CNR/SS = 10 nF, BW = 10 Hz to 100 kHz | 15.4 | μVRMS | ||||
| VIN = 6.2 V, VOUT(nom) = 5 V, COUT = 10 μF, CNR/SS = CFF(3) = 10 nF, BW = 10 Hz to 100 kHz |
21.15 | μVRMS | ||||||
| PSRR | Power-supply rejection ratio | VIN = 6.2 V, VOUT(nom) = 5 V, COUT = 10 μF, CNR/SS = CFF(3) = 10 nF, f = 120 Hz | 72 | dB | ||||
| Tsd | Thermal shutdown temperature | Shutdown, temperature increasing | 170 | °C | ||||
| Reset, temperature decreasing | 150 | °C | ||||||
| TJ | Operating junction temperature | –40 | 125 | °C | ||||
(1) To ensure stability at no load conditions, a current from the feedback resistive network equal to or greater than 5 μA is required.
(2) IFB > 0 flows out of the device.
(4) VREF is measured at the NR/SS pin.
6.6 Typical Characteristics
At TJ = –40°C to 125°C, VIN = VOUT(nom) + 1 V or VIN = 3 V (whichever is greater), VEN = VIN, IOUT = 1 mA, CIN = 2.2 μF, COUT = 2.2 μF, CNR/SS = 0 nF, and the FB pin tied to OUT, unless otherwise noted. Typical values are at TA = 25°C.
