ZHCS235D December 2011 – April 2015 TPS7A33
PRODUCTION DATA.
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) | ±1000 | V |
| Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) | ±500 | |||
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VIN | Input supply voltage | –35 | –3 | V | |
| VEN | Enable supply voltage | VIN | 10 | V | |
| VOUT | Output voltage | –33.2 | VREF | V | |
| IOUT | Output current | 0 | 1 | A | |
| R2(1) | R2 is the lower feedback resistor | 240 | kΩ | ||
| CIN | Input capacitor | 10 | 47 | µF | |
| COUT | Output capacitor | 10 | 47 | µF | |
| CNR | Noise reduction capacitor | 1 | µF | ||
| CFF | Feed-forward capacitor | 10 | nF | ||
| TJ | Operating junction temperature | –40 | 125 | °C | |
| THERMAL METRIC(1) | TPS7A33 | UNIT | ||
|---|---|---|---|---|
| KC (TO-220) | RGW (VQFN) | |||
| 7 PINS | 20 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 31.2 | 33.7 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 40 | 30.4 | |
| RθJB | Junction-to-board thermal resistance | 17.4 | 12.5 | |
| ψJT | Junction-to-top characterization parameter | 6.4 | 0.4 | |
| ψJB | Junction-to-board characterization parameter | 17.2 | 12.5 | |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | 0.8 | 2.4 | |
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||
|---|---|---|---|---|---|---|---|---|
| VIN | Input voltage | –35 | –3 | V | ||||
| VREF | Internal reference | TJ = 25°C, VFB = VREF | –1.192 | –1.175 | –1.157 | V | ||
| VUVLO | Undervoltage lockout threshold | –2 | V | |||||
| VOUT | Output voltage range(2) | |VIN| ≥ |VOUT(nom)| + 1 V | –33.2 | VREF | V | |||
| Nominal accuracy | TJ = 25°C, |VIN| = |VOUT(nom)| + 0.5 V | –1.5 | 1.5 | %VOUT | ||||
| Overall accuracy | 5 V ≤ |VIN| ≤ 35 V 1 mA ≤ IOUT ≤ 1 A |
±1 | %VOUT | |||||
| |VOUT(nom)| + 1 V ≤ |VIN| ≤ 35 V 1 mA ≤ IOUT ≤ 1 A |
–2.5 | 2.5 | ||||||
| ΔVOUT(ΔVI) | Line regulation | |VOUT(nom)| + 1 V ≤ |VIN| ≤ 35 V | 0.14 | %VOUT | ||||
| ΔVOUT(ΔIL) | Load regulation | 1 mA ≤ IOUT ≤ 1 A | 0.4 | %VOUT | ||||
| |VDO| | Dropout voltage | VIN = 95% VOUT(nom), IOUT = 500 mA | 290 | mV | ||||
| VIN = 95% VOUT(nom), IOUT = 1 A | 325 | 800 | ||||||
| ICL | Current limit | VOUT = 90% VOUT(nom) | 1900 | mA | ||||
| IGND | Ground current | IOUT = 0 mA | 210 | 350 | μA | |||
| IOUT = 500 mA | 5 | mA | ||||||
| |ISHDN| | Shutdown supply current | VEN = +0.4 V | 1 | 3 | μA | |||
| VEN = –0.4 V | 1 | 3 | ||||||
| IFB | Feedback current(3) | 14 | 100 | nA | ||||
| |IEN| | Enable current | VEN = |VIN| = |VOUT(nom)| + 1 V | 0.48 | 1 | μA | |||
| VIN = VEN = –35 V | 0.51 | 1 | ||||||
| VIN = –35 V, VEN = +10 V | 0.5 | 1 | ||||||
| VEN(+HI) | Positive enable high-level voltage | 2 | 10 | V | ||||
| VEN(+LO) | Positive enable low-level voltage | 0 | 0.4 | V | ||||
| VEN(–HI) | Negative enable high-level voltage | VIN | –2 | V | ||||
| VEN(–LO) | Negative enable low-level voltage | –0.4 | 0 | V | ||||
| Vn | Output noise voltage | VIN = –3 V, VOUT(nom) = VREF, COUT = 22 μF, CNR/SS = 10 nF, BW = 10 Hz to 100 kHz | 16 | μVRMS | ||||
| PSRR | Power-supply rejection ratio | VIN = –6.2 V, VOUT(nom) = –5 V, COUT = 22 μF, CNR/SS = 10 nF, CFF(4) = 10 nF, f = 10 kHz | 72 | dB | ||||
| Tsd | Thermal shutdown temperature | Shutdown, temperature increasing | 170 | °C | ||||
| Reset, temperature decreasing | 150 | °C | ||||||
| TJ | Operating junction temperature | –40 | 125 | °C | ||||





















