SBVS125D August 2010 – June 2015 TPS7A30
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Parameter Measurement Information
- 8 Detailed Description
-
9 Application and Implementation
- 9.1 Application Information
- 9.2 Typical Application
- 9.3 Do's and Don’ts
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Voltage | IN pin to GND pin | –36 | 0.3 | V |
| OUT pin to GND pin | –33 | 0.3 | V | |
| OUT pin to IN pin | –0.3 | 36 | V | |
| FB pin to GND pin | –2 | 0.3 | V | |
| FB pin to IN pin | –0.3 | 36 | V | |
| EN pin to IN pin | –0.3 | 36 | V | |
| EN pin to GND pin | –36 | 36 | V | |
| NR/SS pin to IN pin | –0.3 | 36 | V | |
| NR/SS pin to GND pin | –2 | 0.3 | V | |
| Current | Peak output | Internally limited | ||
| Temperature | Operating virtual junction, TJ | –40 | 125 | °C |
| Storage, Tstg | –65 | 150 | °C | |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±1500 | V |
| Charged device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VIN | Input supply voltage | –35 | –3 | V | |
| VEN | Enable supply voltage | 0 | VIN | V | |
| VOUT | Output voltage | VREF | 33 | V | |
| IOUT | Output current | 0 | 200 | mA | |
| TJ | Operating junction temperature | –40 | 125 | °C | |
| CIN | Input capacitor | 2.2 | 10 | µF | |
| COUT | Output capacitor | 2.2 | 10 | µF | |
| CNR | Noise reduction capacitor | 0 | 10 | nF | |
| CFF | Feed-forward capacitor | 0 | 10 | nF | |
| R2 | Lower feedback resistor | 237 | kΩ | ||
6.4 Thermal Information
| THERMAL METRIC(1) | TPS7A30 | UNIT | ||
|---|---|---|---|---|
| DGN (HVSSOP PowerPAD) |
DRB (VSON) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 63.4 | 47.7 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 53 | 55.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 37.4 | 23.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 3.7 | 1.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 37.1 | 23.5 | °C/W |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | 13.5 | 7.0 | °C/W |
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics(2)
At TJ = –40°C to 125°C, |VIN| = |VOUT(nom)| + 1 V or |VIN| = 3 V (whichever is greater), VEN = VIN, IOUT = 1 mA, CIN = 2.2 µF, COUT=2.2 µF, CNR/SS = 0 nF, and the FB pin tied to OUT, unless otherwise noted. Typical values are at TA = 25°C.| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||
|---|---|---|---|---|---|---|---|---|
| VIN | Input voltage | –35 | –3 | V | ||||
| VREF | Internal reference(1) | TJ = 25°C, VNR/SS = VREF | –1.202 | –1.179 | –1.166 | V | ||
| VFB | Feedback voltage | –1.176 | V | |||||
| VOUT | Output voltage range(3) | |VIN| ≥ |VOUT(nom)| + 1 V | –33 | VREF | V | |||
| Nominal accuracy | TJ = 25°C, |VIN| = |VOUT(nom)| + 0.5 V | –1.5 | 1.5 | %VOUT | ||||
| Overall accuracy | |VOUT(nom)| + 1 V ≤ |VIN| ≤ 35 V 1 mA ≤ IOUT ≤ 200 mA |
–2.5 | 2.5 | %VOUT | ||||
 |
Line regulation | TJ = 25°C, |VOUT(nom)| + 1 V ≤ |VIN| ≤ 35 V | 0.14 | %VOUT | ||||
 |
Load regulation | TJ = 25°C, 1 mA ≤ IOUT ≤ 200 mA | 0.04 | %VOUT | ||||
| |VDO| | Dropout voltage | VIN = 95% VOUT(nom), IOUT = 100 mA | 216 | mV | ||||
| VIN = 95% VOUT(nom), IOUT = 200 mA | 325 | 600 | mV | |||||
| ICL | Current limit | VOUT = 90% VOUT(nom) | 220 | 330 | 500 | mA | ||
| IGND | Ground current | IOUT = 0 mA | 55 | 100 | μA | |||
| IOUT = 100 mA | 950 | μA | ||||||
| |ISHDN| | Shutdown supply current | VEN = 0.4 V | 1 | 3 | μA | |||
| VEN = –0.4 V | 1 | 3 | μA | |||||
| IFB | Feedback current(4) | 14 | 100 | nA | ||||
| |IEN| | Enable current | VEN = |VIN| = |VOUT(nom)| + 1 V | 0.48 | 1 | μA | |||
| VIN = VEN = –35 V | 0.51 | 1 | μA | |||||
| VIN = –21 V, VEN = 15 V | 0.5 | 1 | μA | |||||
| VEN(+HI) | Positive enable high-level voltage | TJ = –40°C to 125°C | 2 | 15 | V | |||
| TJ = –40°C to 85°C | 1.8 | 15 | V | |||||
| VEN(+LO) | Positive enable low-level voltage | 0 | 0.4 | V | ||||
| VEN(–HI) | Negative enable high-level voltage | VIN | –2 | V | ||||
| VEN(–LO) | Negative enable low-level voltage | –0.4 | 0 | V | ||||
| Vn | Output noise voltage | VIN = –3 V, VOUT(nom) = VREF, COUT = 10 μF, CNR/SS = 10 nF, BW = 10 Hz to 100 kHz | 15.1 | μVRMS | ||||
| VIN = –6.2 V, VOUT(nom) = –5 V, COUT = 10 μF, CNR/SS = CFF(5) = 10 nF, BW = 10 Hz to 100 kHz |
17.5 | μVRMS | ||||||
| PSRR | Power-supply rejection ratio | VIN = –6.2 V, VOUT(nom) = –5 V, COUT = 10 μF, CNR/SS = CFF(5) = 10 nF, f = 120 Hz | 72 | dB | ||||
| TSD | Thermal shutdown temperature | Shutdown, temperature increasing | 170 | °C | ||||
| Reset, temperature decreasing | 150 | °C | ||||||
| TJ | Operating junction temperature range | –40 | 125 | °C | ||||
(1) VREF is measured at the NR/SS pin.
(2) At operating conditions, VIN ≤ 0 V, VOUT(nom) ≤ VREF ≤ 0 V. At regulation, VIN ≤ VOUT(nom) – |VDO|. IOUT > 0 V flows from OUT to IN.
(3) To ensure stability at no load conditions, a current from the feedback resistive network equal to or greater than 5 μA is required.
(4) IFB > 0 V flows into the device.
(5) CFF refers to a feed-forward capacitor connected to the FB and OUT pins.
6.6 Typical Characteristics
At TJ = –40°C to 125°C, |VIN| = |VOUT(nom)| + 1 V or |VIN| = 3 V (whichever is greater), VEN = VIN, IOUT = 1 mA, CIN = 2.2 μF, COUT = 2.2 μF, CNR/SS = 0 nF, and VOUT = VFB, unless otherwise noted. Typical values are at TA = 25°C.
