ZHCSN49N January 2007 – June 2024
PRODUCTION DATA
Figure 4-1 DRC Package,10-Pin VSON With Thermal Pad(Top
View)
Figure 4-2 RGW Package,20-Pin VQFN(Top View)| PIN | I/O | DESCRIPTION | ||
|---|---|---|---|---|
| NAME | VSON | VQFN | ||
| BIAS | 4 | 10 | I | Bias input voltage for error amplifier, reference, and internal control circuits. A 1-μF or larger input capacitor is recommended for optimal performance. If IN is connected to BIAS, a 4.7-μF or larger capacitor must be used. |
| EN | 5 | 11 | I | Enable pin. Driving this pin high enables the regulator. Driving this pin low puts the regulator into shutdown mode. This pin must not be left unconnected. |
| FB | 8 | 16 | I | Feedback pin. The feedback connection to the center tap of an external resistor divider network that sets the output voltage. This pin must not be left floating. |
| GND | 6 | 12 | — | Ground |
| IN | 1, 2 | 5-8 | I | Input to the device. A 1-μF or larger input capacitor is recommended for optimal performance. |
| NC | N/A | 2-4, 13, 14, 17 | — | No connection. This pin can be left floating or connected to GND to allow better thermal contact to the top-side plane. |
| OUT | 9, 10 | 1, 18-20 | O | Regulated output voltage. A small capacitor (total typical capacitance ≥ 2.2 μF, ceramic) is needed from this pin to ground to assure stability. |
| PG | 3 | 9 | O | Power Good pin. An open-drain, active-high output that indicates the status of VOUT. When VOUT exceeds the PG trip threshold, the PG pin goes into a high-impedance state. When VOUT is below this threshold the pin is driven to a low-impedance state. A pull-up resistor from 10 k? to 1 M? should be connected from this pin to a supply of up to 5.5 V. The supply can be higher than the input voltage. Alternatively, the PG pin can be left unconnected if output monitoring is not necessary. |
| SS | 7 | 15 | — | Soft-Start pin. A capacitor connected on this pin to ground sets the start-up time. If this pin is left unconnected, the regulator output soft-start ramp time is typically 200 μs. |
| Thermal pad | — | Must be soldered to the ground plane for increased thermal performance. Internally connected to ground. | ||