ZHCSPJ3T May 2001 – December 2022 TPS715
PRODUCTION DATA
| THERMAL METRIC (1) | Legacy Chip | New Chip | UNIT | |
|---|---|---|---|---|
| DCK (SC-70) | DCK (SC-70) | |||
| 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 253.8 | 195.7 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 73.7 | 88.2 | °C/W |
| RθJB | Junction-to-board thermal resistance | 84.6 | 40.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.1 | 11.2 | °C/W |
| ψJB | Junction-to-board characterization parameter | 83.9 | 40.5 | °C/W |