ZHCSDS8E March 2015 – August 2021 TPS65982
PRODUCTION DATA
- 1 特性
- 2 應用
- 3 說明
- 4 Revision History
- 5 說明（續）
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Power Supply Requirements and Characteristics
- 7.6 Power Supervisor Characteristics
- 7.7 Power Consumption Characteristics (1)
- 7.8 Cable Detection Characteristics
- 7.9 USB-PD Baseband Signal Requirements and Characteristics
- 7.10 USB-PD TX Driver Voltage Adjustment Parameter
- 7.11 Port Power Switch Characteristics
- 7.12 Port Data Multiplexer Switching Characteristics
- 7.13 Port Data Multiplexer Clamp Characteristics
- 7.14 Port Data Multiplexer SBU Detection Characteristics
- 7.15 Port Data Multiplexer Signal Monitoring Pullup and Pulldown Characteristics
- 7.16 Port Data Multiplexer USB Endpoint Characteristics
- 7.17 Port Data Multiplexer BC1.2 Detection Characteristics
- 7.18 Analog-to-Digital Converter (ADC) Characteristics
- 7.19 Input/Output (I/O) Characteristics
- 7.20 I2C Slave Characteristics
- 7.21 SPI Controller Characteristics
- 7.22 BUSPOWERZ Configuration Characteristics
- 7.23 Thermal Shutdown Characteristics
- 7.24 Oscillator Characteristics
- 7.25 Single-Wire Debugger (SWD) Timing Requirements
- 7.26 HPD Timing Requirements
- 7.27 Typical Characteristics
- 8 Parameter Measurement Information
-
9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3
Feature Description
- 9.3.1 USB-PD Physical Layer
- 9.3.2 Cable Plug and Orientation Detection
- 9.3.3
Port Power Switches
- 9.3.3.1 5V Power Delivery
- 9.3.3.2 5V Power Switch as a Source
- 9.3.3.3 PP_5V0 Current Sense
- 9.3.3.4 PP_5V0 Current Limit
- 9.3.3.5 Internal HV Power Delivery
- 9.3.3.6 Internal HV Power Switch as a Source
- 9.3.3.7 Internal HV Power Switch as a Sink
- 9.3.3.8 Internal HV Power Switch Current Sense
- 9.3.3.9 Internal HV Power Switch Current Limit
- 9.3.3.10 External HV Power Delivery
- 9.3.3.11 External HV Power Switch as a Source with RSENSE
- 9.3.3.12 External HV Power Switch as a Sink with RSENSE
- 9.3.3.13 External HV Power Switch as a Sink without RSENSE
- 9.3.3.14 External Current Sense
- 9.3.3.15 External Current Limit
- 9.3.3.16 Soft Start
- 9.3.3.17 BUSPOWERZ
- 9.3.3.18 Voltage Transitions on VBUS through Port Power Switches
- 9.3.3.19 HV Transition to PP_RV0 Pull-Down on VBUS
- 9.3.3.20 VBUS Transition to VSAFE0V
- 9.3.3.21 C_CC1 and C_CC2 Power Configuration and Power Delivery
- 9.3.3.22 PP_CABLE to C_CC1 and C_CC2 Switch Architecture
- 9.3.3.23 PP_CABLE to C_CC1 and C_CC2 Current Limit
- 9.3.4
USB Type-C Port Data Multiplexer
- 9.3.4.1 USB Top and Bottom Ports
- 9.3.4.2 Multiplexer Connection Orientation
- 9.3.4.3 Digital Crossbar Multiplexer
- 9.3.4.4 SBU Crossbar Multiplexer
- 9.3.4.5 Signal Monitoring and Pullup/Pulldown
- 9.3.4.6 Port Multiplexer Clamp
- 9.3.4.7 USB2.0 Low-Speed Endpoint
- 9.3.4.8 Battery Charger (BC1.2) Detection Block
- 9.3.4.9 BC1.2 Data Contact Detect
- 9.3.4.10 BC1.2 Primary and Secondary Detection
- 9.3.5 Power Management
- 9.3.6 Digital Core
- 9.3.7 USB-PD BMC Modem Interface
- 9.3.8 System Glue Logic
- 9.3.9 Power Reset Congrol Module (PRCM)
- 9.3.10 Interrupt Monitor
- 9.3.11 ADC Sense
- 9.3.12 UART
- 9.3.13 I2C Slave
- 9.3.14 SPI Controller
- 9.3.15 Single-Wire Debugger Interface
- 9.3.16 DisplayPort HPD Timers
- 9.3.17 ADC
- 9.3.18 I/O Buffers
- 9.3.19 Thermal Shutdown
- 9.3.20 Oscillators
- 9.4 Device Functional Modes
- 9.5 Programming
-
10Application and Implementation
- 10.1 Application Information
- 10.2
Typical Applications
- 10.2.1
Fully-Featured USB Type-C and PD Charger Application
- 10.2.1.1 Design Requirements
- 10.2.1.2
Detailed Design Procedure
- 10.2.1.2.1 TPS65982 External Flash
- 10.2.1.2.2 I2C (I2C), Debug Control (DEBUG_CTL), and Single-Wire De-bugger (SWD) Resistors
- 10.2.1.2.3 Oscillator (R_OSC) Resistor
- 10.2.1.2.4 VBUS Capacitor and Ferrite Bead
- 10.2.1.2.5 Soft Start (SS) Capacitor
- 10.2.1.2.6 USB Top (C_USB_T), USB Bottom (C_USB_B), and Sideband-Use (SBU) Connections
- 10.2.1.2.7 Port Power Switch (PP_EXT, PP_HV, PP_5V0, and PP_CABLE) Capacitors
- 10.2.1.2.8 Cable Connection (CCn) Capacitors and RPD_Gn Connections
- 10.2.1.2.9 LDO_3V3, LDO_1V8A, LDO_1V8D, LDO_BMC, VOUT_3V3, VIN_3V3, and VDDIO
- 10.2.1.3 Application Curve
- 10.2.2
Dual-Port Notebook Application Supporting USB PD Charging and DisplayPort
- 10.2.2.1 Design Requirements
- 10.2.2.2
Detailed Design Procedure
- 10.2.2.2.1 TPS65982 and System Controller Interaction
- 10.2.2.2.2 HD3SS460 Control and DisplayPort Configuration
- 10.2.2.2.3 9.3.2.3 DC Barrel Jack and Type-C PD Charging
- 10.2.2.2.4 Primary TPS65982 Flash Controller and Secondary Port
- 10.2.2.2.5 TPS65982 Dead Battery Support Primary and Secondary Port
- 10.2.2.2.6 Debugging Methods
- 10.2.2.3 Application Curves
- 10.2.1
Fully-Featured USB Type-C and PD Charger Application
- 11Power Supply Recommendations
-
12Layout
- 12.1
Layout Guidelines
- 12.1.1 TPS65982 Recommended Footprints
- 12.1.2 Alternate TPS65982 Footprint (Oval Pads)
- 12.1.3 Top TPS65982 Placement and Bottom Component Placement and Layout
- 12.1.4 Oval Pad Footprint Layout and Placement
- 12.1.5 Component Placement
- 12.1.6 Designs Rules and Guidance
- 12.1.7 Routing PP_HV, PP_EXT, PP_5V0, and VBUS
- 12.1.8 Routing Top and Bottom Passive Components
- 12.1.9 Void Via Placement
- 12.1.10 Top Layer Routing
- 12.1.11 Inner Signal Layer Routing
- 12.1.12 Bottom Layer Routing
- 12.2 Layout Example
- 12.1
Layout Guidelines
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
12.1.1.1 Standard TPS65982 Footprint (Circular Pads)
Figure 12-1 shows the TPS65982 footprint using a 0.25mm pad diameter. This footprint is applicable to boards that will be using an HDI PCB process that uses smaller vias to fan-out into the inner layers of the PCB. This footprint requires via fill and tenting and is recommended for size-constrained applications. The circular footprint allows for easy fan-out into other layers of the PCB and better thermal dissipation into the GND planes. Figure 12-2 shows the recommended via sizing for use under the balls. The size is 5mil hole and 10mil diameter. This via size will allow for approximately 1.5A current rating at 3 mΩ of DC resistance with 1.6nH of inductance. It is recommended to verify these numbers with board manufacturing processes used in fabrication of the PCB. This footprint is available for download on the TPS65982 product folder on the TPS65982 product folder.
Figure 12-1 Top View Standard TPS65982 Footprint (Circular Pads)
Figure 12-2 Under Ball Recommended Via Size