ZHCSM97A November 2020 – August 2021 TPS6521845
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
-
7 Detailed Description
- 7.1 Overview
- 7.2 Functional Block Diagram
- 7.3
Feature Description
- 7.3.1
Wake-Up and Power-Up and Power-Down Sequencing
- 7.3.1.1 Power-Up Sequencing
- 7.3.1.2 Power-Down Sequencing
- 7.3.1.3 Strobe 1 and Strobe 2
- 7.3.1.4 Supply Voltage Supervisor and Power-Good (PGOOD)
- 7.3.1.5 Backup Supply Power-Good (PGOOD_BU)
- 7.3.1.6 Internal LDO (INT_LDO)
- 7.3.1.7 Current Limited Load Switches
- 7.3.1.8 LDO1
- 7.3.1.9 Coin Cell Battery Voltage Acquisition
- 7.3.1.10 UVLO
- 7.3.1.11 Power-Fail Comparator
- 7.3.1.12 Battery-Backup Supply Power-Path
- 7.3.1.13 DCDC3 and DCDC4 Power-Up Default Selection
- 7.3.1.14 I/O Configuration
- 7.3.1.15 Push Button Input (PB)
- 7.3.1.16 AC_DET Input (AC_DET)
- 7.3.1.17 Interrupt Pin (INT)
- 7.3.1.18 I2C Bus Operation
- 7.3.1
Wake-Up and Power-Up and Power-Down Sequencing
- 7.4 Device Functional Modes
- 7.5 Register Maps
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
封裝選項
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RSL|48
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
- RSL|48
訂購信息
11.5 靜電放電警告
 |
靜電放電 (ESD) 會損壞這個集成電路。德州儀器 (TI) 建議通過適當(dāng)?shù)念A(yù)防措施處理所有集成電路。如果不遵守正確的處理和安裝程序，可能會損壞集成電路。 |
| ESD 的損壞小至導(dǎo)致微小的性能降級，大至整個器件故障。精密的集成電路可能更容易受到損壞，這是因為非常細(xì)微的參數(shù)更改都可能會導(dǎo)致器件與其發(fā)布的規(guī)格不相符。 |