ZHCSCH4H June   2013  – November 2016 TPS65132

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

1. 1 特性
2. 2 應(yīng)用范圍
3. 3 說明
4. 4 修訂歷史記錄
5. 5  Device Comparison Table
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 I2C Interface Timing Requirements / Characteristics
   7. 7.7 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO)
      2. 8.3.2 Active Discharge
      3. 8.3.3 Boost Converter
         1. 8.3.3.1 Boost Converter Operation
         2. 8.3.3.2 Power-Up And Soft-Start (Boost Converter)
         3. 8.3.3.3 Power-Down (Boost Converter)
         4. 8.3.3.4 Isolation (Boost Converter)
         5. 8.3.3.5 Output Voltage (Boost Converter)
         6. 8.3.3.6 Advanced Power-Save Mode For Light-Load Efficiency And PFM
      4. 8.3.4 LDO Regulator
         1. 8.3.4.1 LDO Operation
         2. 8.3.4.2 Power-Up And Soft-Start (LDO)
         3. 8.3.4.3 Power-Down And Discharge (LDO)
         4. 8.3.4.4 Isolation (LDO)
         5. 8.3.4.5 Setting The Output Voltage (LDO)
      5. 8.3.5 Negative Charge Pump
         1. 8.3.5.1 Operation
         2. 8.3.5.2 Power-Up And Soft-Start (CPN)
         3. 8.3.5.3 Power-Down And Discharge (CPN)
         4. 8.3.5.4 Isolation (CPN)
         5. 8.3.5.5 Setting The Output Voltage (CPN)
   4. 8.4 Device Functional Modes
      1. 8.4.1 Enabling and Disabling the Device
   5. 8.5 Programming
      1. 8.5.1 I2C Serial Interface Description
      2. 8.5.2 I2C Interface Protocol
   6. 8.6 Register Maps
      1. 8.6.1 Registers
         1. 8.6.1.1 VPOS Register - Address: 0x00
         2. 8.6.1.2 VNEG Register - Address 0x01
         3. 8.6.1.3 DLYx Register - Address 0x02 (Only valid for TPS65132Sx)
         4. 8.6.1.4 APPS - SEQU - SEQD - DISP - DISN Register - Address 0x03
         5. 8.6.1.5 Control Register - Address 0xFF
      2. 8.6.2 Factory Default Register Value
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Applications
      1. 9.2.1 Low-current Applications (≤ 40 mA)
         1. 9.2.1.1 Design Requirements
         2. 9.2.1.2 Detailed Design Procedure
            1. 9.2.1.2.1 Sequencing
            2. 9.2.1.2.2 Boost Converter Design Procedure
               1. 9.2.1.2.2.1 Inductor Selection (Boost Converter)
               2. 9.2.1.2.2.2 Input Capacitor Selection (Boost Converter)
               3. 9.2.1.2.2.3 Output Capacitor Selection (Boost Converter)
            3. 9.2.1.2.3 Input Capacitor Selection (LDO)
            4. 9.2.1.2.4 Output Capacitor Selection (LDO)
            5. 9.2.1.2.5 Input Capacitor Selection (CPN)
            6. 9.2.1.2.6 Output Capacitor Selection (CPN)
            7. 9.2.1.2.7 Flying Capacitor Selection (CPN)
         3. 9.2.1.3 Application Curves
      2. 9.2.2 Mid-current Applications (≤ 80 mA)
         1. 9.2.2.1 Design Requirements
         2. 9.2.2.2 Detailed Design Procedure
            1. 9.2.2.2.1 Boost Converter Design Procedure
               1. 9.2.2.2.1.1 Inductor Selection (Boost Converter)
               2. 9.2.2.2.1.2 Input Capacitor Selection (Boost Converter)
               3. 9.2.2.2.1.3 Output Capacitor Selection (Boost Converter)
            2. 9.2.2.2.2 Input Capacitor Selection (LDO)
            3. 9.2.2.2.3 Output Capacitor Selection (LDO)
            4. 9.2.2.2.4 Input Capacitor Selection (CPN)
            5. 9.2.2.2.5 Output Capacitor Selection (CPN)
            6. 9.2.2.2.6 Flying Capacitor Selection (CPN)
         3. 9.2.2.3 Application Curves
      3. 9.2.3 High-current Applications (≤ 150 mA)
         1. 9.2.3.1 Design Requirements
         2. 9.2.3.2 Detailed Design Procedure
            1. 9.2.3.2.1 Sequencing
            2. 9.2.3.2.2 SYNC = HIGH
            3. 9.2.3.2.3 Startup
         3. 9.2.3.3 Application Curves
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
12. 12器件和文檔支持
    1. 12.1 器件支持
       1. 12.1.1 第三方產(chǎn)品免責(zé)聲明
    2. 12.2 接收文檔更新通知
    3. 12.3 社區(qū)資源
    4. 12.4 商標(biāo)
    5. 12.5 靜電放電警告
    6. 12.6 Glossary
13. 13機(jī)械、封裝和可訂購信息
    1. 13.1 CSP 封裝概要
       1. 13.1.1 芯片級封裝尺寸
       2. 13.1.2 RVC 封裝概要