ZHCSI59I July 2009 – May 2018 TPS65070 , TPS65072 , TPS65073 , TPS650731 , TPS650732
UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
As for all switching power supplies, the layout is an important step in the design. Proper function of the device demands careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If the layout is not carefully done, the regulators may show poor line and/or load regulation, and stability issues as well as EMI problems. It is critical to provide a low impedance ground path. Therefore, use wide and short traces for the main current paths. The input capacitors should be placed as close as possible to the IC pins as well as the inductor and output capacitor.
For TPS6507x, connect the PGND pin of the device to the thermal pad land of the PCB and connect the analog ground connection (GND) to the PGND at the thermal pad. The thermal pad serves as the power ground connection for the DCDC1 and DCDC2 converters. Therefore it is essential to provide a good thermal and electrical connection to GND using multiple vias to the GND-plane. Keep the common path to the GND pin, which returns the small signal components, and the high current of the output capacitors as short as possible to avoid ground noise. The VDCDCx line should be connected right to the output capacitor and routed away from noisy components and traces (for example, the L1, L2, L3 and L4 traces). See the TPS6507xEVM users guide for details about the layout for TPS6507x.