SLVS613D October 2005 – December 2015 TPS65021
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Description (continued)
- 6 Pin Configuration and Functions
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7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Thermal Information
- 7.5 Electrical Characteristics
- 7.6 Electrical Characteristics: Supply Pins VCC, VINDCDC1, VINDCDC2, VINDCDC3
- 7.7 Electrical Characteristics: Supply Pins VBACKUP, VSYSIN, VRTC, VINLDO
- 7.8 Electrical Characteristics: VDCDC1 Step-Down Converter
- 7.9 Electrical Characteristics: VDCDC2 Step-Down Converter
- 7.10 Electrical Characteristics: VDCDC3 Step-Down Converter
- 7.11 Timing Requirements
- 7.12 Typical Characteristics
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8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 VRTC Output and Operation With or Without Backup Battery
- 8.3.2 Step-Down Converters, VDCDC1, VDCDC2, and VDCDC3
- 8.3.3 Power Save Mode Operation
- 8.3.4 Low-Ripple Mode
- 8.3.5 Soft-Start
- 8.3.6 100% Duty Cycle Low-Dropout Operation
- 8.3.7 Active Discharge When Disabled
- 8.3.8 Power-Good Monitoring
- 8.3.9 Low-Dropout Voltage Regulators
- 8.3.10 Undervoltage Lockout
- 8.3.11 Power-Up Sequencing
- 8.4 Device Functional Modes
- 8.5 Programming
- 8.6
Register Maps
- 8.6.1 VERSION Register Address: 00h (Read Only)
- 8.6.2 PGOODZ Register Address: 01h (Read Only)
- 8.6.3 MASK Register Address: 02h (Read and Write), Default Value: C0h
- 8.6.4 REG_CTRL Register Address: 03h (Read and Write), Default Value: FFh
- 8.6.5 CON_CTRL Register Address: 04h (Read and Write), Default Value: B1h
- 8.6.6 CON_CTRL2 Register Address: 05h (Read and Write), Default Value: 40h
- 8.6.7 DEFCORE Register Address: 06h (Read and Write), Default Value: 14h/1Eh
- 8.6.8 DEFSLEW Register Address: 07h (Read and Write), Default Value: 06h
- 8.6.9 LDO_CTRL Register Address: 08h (Read and Write), Default Value: Set With DEFLDO1 and DEFLDO2
- 9 Application and Implementation
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
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TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
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Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.3 Trademarks
TMS320, OMAP, PowerPAD, E2E are trademarks of Texas Instruments.
Intel is a registered trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.