ZHCSIG5E July 2018 – August 2021 TPS63805 , TPS63806 , TPS63807
PRODUCTION DATA
- 1 特性
- 2 應(yīng)用
- 3 說明
- 4 Revision History
- 5 說明（續(xù)）
- 6 Device Comparison Table
- 7 Pin Configuration and Functions
- 8 Specifications
-
9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3
Feature Description
- 9.3.1 Control Loop Description
- 9.3.2 Precise Device Enable: Threshold- or Delayed Enable
- 9.3.3 Mode Selection (PFM/PWM)
- 9.3.4 Undervoltage Lockout (UVLO)
- 9.3.5 Soft Start
- 9.3.6 Adjustable Output Voltage
- 9.3.7 Overtemperature Protection - Thermal Shutdown
- 9.3.8 Input Overvoltage - Reverse-Boost Protection (IVP)
- 9.3.9 Output Overvoltage Protection (OVP)
- 9.3.10 Power-Good Indicator
- 9.4 Device Functional Modes
- 10Application and Implementation
- 11Power Supply Recommendations
- 12Layout
- 13Device and Documentation Support
- 14Mechanical, Packaging, and Orderable Information
封裝選項(xiàng)
機(jī)械數(shù)據(jù) (封裝 | 引腳)
- YFF|15
散熱焊盤機(jī)械數(shù)據(jù) (封裝 | 引腳)
訂購信息
13.5 Electrostatic Discharge Caution
 |
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. |
| ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |