ZHCSBD3D July 2013 – August 2019 TPS63050 , TPS63051
PRODUCTION DATA.
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the powerdissipation limits of a given component.
Two basic approaches for enhancing thermal performance are listed below:
For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics (SZZA017), and Semiconductor and IC Package Thermal Metrics (SPRA953)